System

Form Factor;8U Rackmount Enclosure Dimension;437 x 355.6 x 843.28 мм (17.2" x 14" x 33.2") Package Dimension;698 x 750 x 1300 мм (27.5" x 29.5" x 51.2") Processor;Dual Socket E (LGA-4677), 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors, до 64C/128T, до 320MB Cache per CPU GPU Max Count;8 onboard GPUs Supported GPU;NVIDIA SXM: HGX H100 8-GPU (80GB), HGX H200 8-GPU (141GB) CPU-GPU Interconnect;PCIe 5.0 x16 CPU-to-GPU Interconnect GPU-GPU Interconnect;NVIDIA® NVLink™ with NVSwitch™ System Memory Slot Count;32 DIMM slots Max Memory (1DPC);До 4TB 5600MT/s ECC DDR5 RDIMM Max Memory (2DPC);До 8TB 4400MT/s ECC DDR5 RDIMM Drive Bays Configuration (Default);Всего 15 bays: 12 front hot-swap 2.5" NVMe + 3 front hot-swap 2.5" SATA Drive Bays Configuration (Option A);Всего 19 bays: 12 front hot-swap 2.5" NVMe + 4 front hot-swap 2.5" NVMe* + 3 front hot-swap 2.5" SATA (*NVMe может требовать доп. контроллер/кабели) M.2;2 M.2 NVMe slots (M-key) Expansion Slots (Default);8 PCIe 5.0 x16 LP slots + 2 PCIe 5.0 x16 FHHL slots Expansion Slots (Option A);2 PCIe 5.0 x16 FHHL slots Chipset;Intel® C741 Network Connectivity (опции);2 RJ45 10GbE (Intel® X550-AT2) / 2 SFP28 25GbE (Broadcom® BCM57414) / 2 RJ45 10GbE (Intel® X710-AT2) Video;1 VGA port TPM;1 TPM header